INNOVATION
A NEW PARADIGM IN MICRO-DEVICE MANUFACTURING
For years, the de facto standard for making very small structures has been the use of silicon-based processes, leveraging the successes of semiconductor manufacturing. However, while this technology is excellent for building microcircuits, it has serious limitations for building complex 3D mechanical products. As a result, semiconductor-based MEMS manufacturing has only been able to miniaturize less than 8% of the over $200 Billion industrial components market. Despite extensive MEMs-based effort, many components such as sensors, energy harvesters, and microwave devices are still large, bulky, and costly solutions. Integra Devices leverages a groundbreaking new paradigm to build micro-devices, created from over 15 years of research and over $20 million in funding at the University of California, Irvine.
Amalga™ leverages 3D heterogeneous integration technology practiced in the microelectronics packaging industry, using lamination strategies to build-up complex 3D structures. Different layers of materials (e.g. films, foils) are processed and bonded together to produce a final panel of structures. This allows a wide variety of manufacturing processes and materials to be included, and individual panel fabrication can be outsourced to manufacturers with optimized processes for those layers.
OUR ENGINE - INTRODUCING AMALGA
GREATER MATERIAL SELECTION
COMPLETE INTEGRATION
• Structural materials
• Biocompatible materials
• Optical materials
• Electronic materials
• Specialty materials
• Thin-films processing
• Micro assembly
• Machining
• Laser forming
• Electroforming
• Embossing
• Injection molding
• Lithography
• Lamination
• Bonding
ALREADY PACKAGED
FABLESS, BATCH MANUFACTURING